Photo-Etched Filters

Polymer

Photo-Etched Filters

Photo etched film is manufactured using a chemical etching process to produce precise metal sheets with intricate micropore networks. This technology is commonly used in high-quality filament spinning and precision separation systems to prevent spinneret capillary blockages. By utilizing photolithographic masking, we process various complex shapes and graphic meshes on metal sheets with extreme accuracy, achieving configurations that are impossible with traditional stamping, drilling, or laser cutting.

High precision down to a minimum hole diameter of 0.01mm.
No mechanical stresses or burrs, ensuring smooth flow channels.
Cost-effective prototyping and quick lead times.
Supports stainless steel, copper, aluminum, and alloy plates.

Get a Quote Go Back

Photochemical Precision Etching

Photochemical etching (photo etching) provides a burr-free, stress-free metal filtration sheet. Traditional processes like mechanical punching or laser cutting deform the edges and alter physical properties around holes, reducing flow uniformity and filtration accuracy.

Our photo etched plates are widely used in chemical fiber, petroleum, food processing, pharmaceuticals, and environmental engineering. By customizing hole sizes and shapes, we ensure optimal shear resistance, uniform polymer melt distribution, and efficient impurity capture.

Available Base Materials:

Stainless steel sheet (304, 316L), copper sheet, aluminum sheet, nickel sheet, and other high-performance alloys.

The Etching Process Principle

Etching involves plate coating and exposure to transfer the designed geometric CAD patterns to the metal sheet. Areas not protected by photoresist are dissolved by controlled chemical solutions, resulting in precise apertures and shapes.

Production Workflow Steps:

Sheet Sizing: Cut the metal plate according to CAD specifications.
CAD Graphic Application: Apply high-resolution photoresist to the metal.
Photolithography: Exposure, development, and oven drying to lock the pattern.
Chemical Etching: Spray etching solutions to dissolve uncovered metal.
Resist Stripping: Ink/resist removal followed by cleaning, drying, and inspection.

Technical Limits & Capabilities

Maximum Etching Area	500 mm × 600 mm
Material Thickness Range	0.01 mm - 2.0 mm (Highly optimized for ultra-thin sheets under 0.5 mm)
Minimum Wire / Hole Diameter	0.01 mm - 0.03 mm
Dimensional Tolerance	± 0.01 mm (depending on thickness)

Hole Configurations & Categories

(1) Microporous Round Holes

Shapes: round, semicircular, rectangular. Thicknesses: 0.05, 0.08, 0.10, 0.12, 0.15 mm.

(2) Microporous Waist-Shaped Pores

Shapes: round, semicircular, rectangular. Thicknesses: 0.05, 0.08, 0.10, 0.12, 0.15 mm.

Photo-Etched Filters